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1. product profile 1.1 general description the mmic is a one-stage amplifier, offe red in a low-cost leadless surface-mount package. it delivers 28 dbm output power at 1 db gain compression and a superior performance up to 2700 mhz. its power saving features include simple quiescent current adjustment, which allows class-ab operation and logic-level shutdown control to reduce the supply current to 4 a. 1.2 features and benefits ? 400 mhz to 2700 mhz frequency operating range ? 12 db small signal gain at 2 ghz ? 28 dbm output power at 1 db gain compression ? integrated active biasing ? external matching allows broad application optimization of the el ectrical performance ? 5 v single supply operation ? all pins esd protected 1.3 applications 1.4 quick reference data [1] operation outside this range is possible but not guaranteed. [2] p l = 17 dbm per tone; spacing = 1 mhz. BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier rev. 01 ? 26 july 2010 product data sheet ? broadband cpe/moca ? industrial applications ? wlan/ism/rfid ? e-metering ? wireless infrastructure (base station, repeater, backhaul systems) ? satellite master an tenna tv (smatv) table 1. quick reference data input and output impedances matched to 50 , shdn = high (shutdown disabled). typical values at v cc =5v; i cc = 180 ma; t case =25 c; unless otherwise specified. symbol parameter conditions min typ max unit f frequency [1] 400 - 2700 mhz g p power gain f = 2140 mhz 10.5 12 13.5 db p l(1db) output power at 1 db gain compression f = 2140 mhz 26.5 28.0 - dbm ip3 o output third-order intercept point f = 2140 mhz [2] 38 42 - dbm
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 2 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 2. pinning information 2.1 pinning 2.2 pin description [1] this pin is dc-coupled and requires an external dc-blocking capacitor. [2] rf decoupled. [3] the center metal base of the sot908-1 also functions as heatsink for the power amplifier. 3. ordering information fig 1. pin configuration 001aam036 v cc(bias) shdn v cc(rf) rf_in v cc(rf) icq_adj n.c. transparent top view 5 4 6 3 7 2 8 1 terminal 1 index area BGA7127 gnd pad n.c. table 2. pin description symbol pin description n.c. 1, 4 not connected v cc(rf) 2, 3 rf output for the power ampl ifier and dc supply input for the rf transistor collector [1] v cc(bias) 5 bias supply voltage [2] shdn 6 shutdown control function enabled / disabled rf_in 7 rf input for the power amplifier [1] icq_adj 8 quiescent co llector current adjustment by an external resistor gnd gnd pad rf ground and dc ground [3] table 3. ordering information type number package name description version BGA7127 hvson8 plastic thermal en hanced very thin small outline package; no leads; 8 terminals; body 3 3 0.85 mm sot908-1
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 3 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 4. functional diagram 5. shutdown control fig 2. functional diagram bandgap output match input match bias enable v/i converter rf_out gnd r1 r2 rf_in shdn v cc icq_adj 6 7 58 2, 3 014aab047 v cc(bias) v cc(rf) table 4. shutdown control settings mode mode description function description shdn v ctrl(sd) (v) i ctrl(sd) ( a) min max min max idle medium power mmic fully off; minimal supply current shutdown control enabled 0 0 0.7 - 2 tx medium power mmic transmit mode shutdown control disabled 1 2.5 v cc(bias) -3
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 4 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 6. limiting values [1] see figure 3 for safe operating area. [2] the supply current is adjustable. see section 8.1 ? supply current adjustment ? and section 12 ? application information ? . [3] if v ctrl(sd) exceeds v cc(bias) , the internal esd circuit can be damaged. the recommended preventive measure is to limit the i ctrl(sd) to 20 ma. if the shdn function is not used, t he shdn pin should be connected to v cc(bias) . table 5. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v cc(rf) rf supply voltage [1] -6.0v v cc(bias) bias supply voltage [1] -6.0v i cc supply current [1] [2] -325ma v ctrl(sd) shutdown control voltage [3] 0.0 v cc(bias) v p i(rf) rf input power - 25 dbm t case case temperature ? 40 +85 c t j junction temperature - 150 c v esd electrostatic discharge voltage human body model (hbm); according jedec standard 22-a114e -2000v charged device model (cdm); according jedec standard 22-c101b -500v exceeding the safe operating area limits may cause serious damage to the product. the impact on i cc due to the spread of the external icq resistor (r2) should be taken into account. the product-spread on i cc should be taken into account (see section 8 ? static characteristics ? ). fig 3. BGA7127 dc safe operating area v cc(rf) (v) 27 6 45 3 001aal536 200 250 150 300 350 i cc (ma) 100
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 5 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 7. thermal characteristics [1] defined as thermal resistanc e from junction to gnd pad. 8. static characteristics [1] the supply current is adjustable. see section 8.1 ? supply current adjustment ? and section 12 ? application information ? . [2] see section 12 ? application information ? . 8.1 supply current adjustment the supply current can be adjusted by changing the value of external icq resistor (r2). table 6. thermal characteristics symbol parameter conditions typ max unit r th(j-mb) thermal resistance from junction to mounting base t case =85 c; v cc =5v; i cc = 180 ma [1] 28 - k/w table 7. characteristics input and output impedances matched to 50 , shdn = high (shutdown disabled). typical values at v cc =5.0v; t case =25 c; unless otherwise specified. symbol parameter conditions min typ max unit i cc supply current [1] 100 - 250 ma r1 = 1 ; r2 = 909 , e96 [2] 160 180 200 ma r1 = 1.8 ; r2 = 909 , e96 [2] 160 180 200 ma during shutdown; pin shdn =low (shutdown enabled) -46 a fig 4. supply current as a function of the value of r2 at a supply voltage of 5 v. r2 ( ) 700 1700 1500 1100 1300 900 001aal537 150 200 250 i cc (ma) 100
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 6 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 9. dynamic characteristics [1] operation outside this range is possible but not guaranteed. [2] defined at p i = ? 40 dbm; small signal conditions. [3] p l = 17 dbm; tone spacing = 1 mhz. table 8. characteristics at v cc = 5 v input and output impeda nces matched to 50 , shdn = high (shutdown disabled). typical values at v cc =5v; i cc = 180 ma; t case =25 c; see section 12 ? application information ? ; unless otherwise specified. symbol parameter conditions min typ max unit f frequency [1] 400 - 2700 mhz g p power gain f = 940 mhz [2] -20- db f = 1960 mhz [2] -13- db f = 2140 mhz [2] 10.5 12 - db f = 2445 mhz [2] -11- db p l(1db) output power at 1 db gain compression f = 940 mhz - 27.5 - dbm f = 1960 mhz - 28.5 - dbm f = 2140 mhz 26.5 28.0 - dbm f = 2445 mhz - 27.5 - dbm ip3 o output third-order intercept point f = 940 mhz [3] -42- dbm f = 1960 mhz [3] -42- dbm f = 2140 mhz [3] 38 42 - dbm f = 2445 mhz [3] -41- dbm nf noise figure f = 940 mhz - 2.8 - db f = 1960 mhz - 4.4 - db f = 2140 mhz - 4.5 - db f = 2445 mhz - 4.8 - db rl in input return loss f = 940 mhz [2] - ? 24 - db f = 1960 mhz [2] - ? 10 - db f = 2140 mhz [2] - ? 9- db f = 2445 mhz [2] - ? 11 - db rl out output return loss f = 940 mhz [2] - ? 11 - db f = 1960 mhz [2] - ? 13 - db f = 2140 mhz [2] - ? 10 - db f = 2445 mhz [2] - ? 19 - db
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 7 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 9.1 scattering parameters 10. reliability information 11. moisture sensitivity table 9. scattering parameters at 5 v, mmic only v cc =5v; i cc =180ma; t case =25 c. f (mhz) s 11 s 21 s 12 s 22 magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) 400 0.92 178 8.64 91 0.01 45 0.75 ? 173 500 0.91 176 6.95 88 0.01 49 0.76 ? 175 600 0.91 174 5.88 86 0.01 51 0.75 ? 176 700 0.91 172 5.05 83 0.02 53 0.75 ? 178 800 0.91 170 4.47 81 0.02 55 0.74 ? 180 900 0.91 167 4.01 79 0.02 55 0.74 179 1000 0.90 165 3.64 76 0.02 54 0.75 177 1100 0.90 163 3.30 74 0.02 52 0.76 175 1200 0.90 161 3.0 71 0.02 51 0.75 173 1300 0.91 159 2.75 69 0.03 50 0.76 172 1400 0.91 156 2.53 67 0.03 51 0.76 171 1500 0.92 155 2.33 65 0.03 52 0.77 170 1600 0.92 153 2.16 64 0.03 52 0.77 169 1700 0.92 152 2.01 62 0.03 51 0.78 168 1800 0.92 152 1.86 61 0.03 48 0.78 168 1900 0.93 151 1.75 60 0.03 49 0.79 168 2000 0.93 152 1.64 60 0.03 51 0.80 168 2100 0.93 151 1.56 59 0.04 52 0.80 169 2200 0.93 151 1.48 58 0.04 52 0.80 169 2300 0.92 151 1.43 57 0.04 52 0.80 170 2400 0.92 151 1.38 57 0.04 52 0.79 171 2500 0.90 152 1.33 57 0.04 51 0.80 172 2600 0.90 152 1.29 56 0.04 50 0.79 173 2700 0.89 152 1.27 55 0.05 50 0.78 173 table 10. reliability life test conditions intrinsic failure rate htol according to jesd85; c onfidence level 60 %; t j =55 c; activation energy = 0.7 ev; acceleration factor determined according to the arrhenius equation. 4 table 11. moisture sensitivity level test methodology class jesd-22-a113 1
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 8 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 12. application information 12.1 5 v application 12.1.1 920 mhz to 960 mhz at 5 v; 180 ma see table 12 for a list of components. pcb board specification: rogers ro4003c; height = 0.508 mm; r = 3.38; copper thickness = 35 m. fig 5. 5 v application schematic; 920 mhz to 960 mhz c8 c3 c4 c6 c7 c5 r1 r2 icq_adj shdn enable l1 l2 c2 c1 msl1 msl2 msl3 msl8 msl5 msl7 rf_in BGA7127 50 50 v cc 001aam03 7 msl4 v cc(rf) v cc(bias) msl6 (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. fig 6. output power at 1 db gain compression as a function of frequency fig 7. power gain as a function of frequency f (ghz) 0.92 0.96 0.95 0.93 0.94 001aam170 26 28 24 30 32 p l(1db) (dbm) 22 (1) (2) (3) f (ghz) 0.92 0.96 0.95 0.93 0.94 001aam171 20 22 18 24 26 g p (db) 16 (1) (2) (3)
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 9 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier t case = 25 c. (1) rl in . (2) rl out . (3) isl. p l = 17 dbm; tone spacing = 1 mhz (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. fig 8. input return loss, output return loss and isolation as a function of frequency fig 9. output third-order in tercept point as a function of frequency f (ghz) 0.92 0.96 0.95 0.93 0.94 001aam172 ? 35 ? 30 ? 25 ? 20 ? 15 ? 10 ? 5 (2) (3) (1) rl in , rl out , isl (db) 0 f (ghz) 0.92 0.96 0.95 0.93 0.94 001aam173 40 42 38 44 46 ip3 o (dbm) 36 (1) (2) (3) see table 12 for a list of components. fig 10. 5 v application reference board; 920 mhz to 960 mhz j3 gnd v cc gnd n.c. ena ble gnd c7 c10 c8 c4 c3 l2 c1 r2 c2 l1 c5 r1 msl6 msl7 msl4 msl5 msl8 msl3 msl1 msl2 j3 j1 rf in j2 rf out 001aam038
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 10 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier [1] msl1 to msl8 dimensions are specifi ed as width (w), spacing (s) and length (l). table 12. 5 v application list of components; 920 mhz to 960 mhz see figure 5 and figure 10 for component layout. printed-circuit board (pcb): rogers ro4003c st ack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks c1, c4 capacitor 68 pf dc blocking grm1885c1h680ja01d c2 capacitor 9.1 pf input match murata grm1885c1h9r1cz01d c3 capacitor 5.1 pf output match murata grm1885c1h5r1cz01d c5 capacitor 10 nf rf decoupling murata grm1885c1h1r0cz01d c6 capacitor 1 f lf decoupling avx 06033d105kat2a c7 capacitor 10 f lf decoupling avx 1206zg106zat2a c8 capacitor 12 pf noise decoupling murata grm1555c1h120jz01d j1, j2 rf connector sma emerson network power 142-0701-841 j3 dc connector 6 pins molex l1 inductor 2.2 nh output match tyco electronics 36501j2n2jtdg l2 inductor 22 nh dc feed tyco electronics 36501j022jtdg pcb ro4003c stack kovo msl1 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match msl2 [1] micro stripline 1.14 mm 0.8 mm 6.8 mm input match msl3 [1] micro stripline 1.14 mm 0.8 mm 4.4mm input match msl4 [1] micro stripline 1.14 mm 0.8 mm 2.0 mm output match msl5 [1] micro stripline 1.14 mm 0.8 mm 3.2 mm output match msl6 [1] micro stripline 1.14 mm 0.8 mm 4.2 mm output match msl7 [1] micro stripline 1.14 mm 0.8 mm 1.8 mm output match msl8 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match r1 resistor 1.8 yageo rc0603fr-071r8l r2 resistor 2 k trimmer bias adjustment bourns 3214w-1-202e
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 11 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 12.1.2 1930 mhz to 1990 mhz at 5 v; 180 ma see table 13 for a list of components. pcb board specification: rogers ro4003c; height = 0.508 mm; r = 3.38; copper thickness = 35 m. fig 11. 5 v application schematic; 1930 mhz to 1990 mhz c3 c4 c6 c7 c5 r1 r2 icq_adj shdn enable l1 c2 c1 msl1 msl2 msl6 msl3 msl5 rf_in BGA7127 50 50 v cc 001aam17 7 v cc(bias) msl4 v cc(rf) (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. fig 12. output power at 1 db gain compression as a function of frequency fig 13. power gain as a function of frequency 001aam117 f (ghz) 1.93 1.99 1.97 1.95 26 28 24 30 32 p l(1db) (dbm) 22 (1) (2) (3) 001aam118 f (ghz) 1.93 1.99 1.97 1.95 12 14 10 16 18 g p (db) 8 (1) (2) (3)
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 12 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier t case = 25 c. (1) rl in . (2) rl out . (3) isl. p l = 17 dbm; tone spacing = 1 mhz (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. fig 14. input return loss, output return loss and isolation as a function of frequency fig 15. output third-order in tercept point as a function of frequency f (ghz) 1.93 1.99 1.97 1.95 001aam119 ? 20 ? 10 0 ? 30 (1) (2) (3) rl in , rl out , isl (db) 001aam120 f (ghz) 1.93 1.99 1.97 1.95 40 42 38 44 46 ip3 o (dbm) 36 (1) (2) (3) see table 13 for a list of components. fig 16. 5 v application reference board; 1930 mhz to 1990 mhz j3 gnd v cc gnd n.c. enable gnd c7 c6 c4 c3 c2 c1 r2 l1 c5 r1 msl6 msl4 msl5 msl1 msl2 msl3 j3 j1 rf in j2 rf out 001aam039
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 13 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier [1] msl1 to msl6 dimensions are specifi ed as width (w), spacing (s) and length (l). 12.1.3 2110 mhz to 2170 mhz at 5 v; 180 ma table 13. 5 v application list of components; 1930 mhz to 1990 mhz see figure 11 and figure 16 for component layout. printed-circuit board (pcb): rogers ro4003c st ack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks c1,c4 capacitor 15 pf dc blocking grm1885c1h150ja01d c2 capacitor 2.7 pf input match murata, grm1885c1h2r7cz01d c3 capacitor 1.8 pf output matc h murata, grm1885c1h1r8cz01d c5 capacitor 15 pf rf decoupling murata, grm1885c1h150ja01d c6 capacitor 100 nf lf decoupling avx, 0603yc104kat2a c7 capacitor 10 f lf decoupling avx, 1206zg106zat2a j1,j2 rf connector sma emerson network power, 142-0701-841 j3 dc connector 6 pins molex l1 inductor 22 nh dc feed tyco electronics, 36501j022jtdg msl1 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match msl2 [1] micro stripline 1.14 mm 0.8 mm 11.4 mm input match msl3 [1] micro stripline 1.14 mm 0.8 mm 5.9 mm output match msl4 [1] micro stripline 1.14 mm 0.8 mm 1.4 mm output match msl5 [1] micro stripline 1.14 mm 0.8 mm 4.6 mm output match msl6 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match r1 resistor 1 yageo, rc0603fr-071rl r2 resistor 2 k trimmer bias adjustment bourns, 3214w-1-202e see table 14 for a list of components. pcb board specification: rogers ro4003c; height = 0.508 mm; r = 3.38; copper thickness = 35 m. fig 17. 5 v application schematic; 2110 mhz to 2170 mhz c4 c6 c7 c5 r1 r2 icq_adj shdn enable l1 c2 c3 c1 msl1 msl2 msl5 msl4 rf_in BGA7127 50 50 v cc 001aam04 0 msl3 v cc(bias) v cc(rf)
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 14 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. fig 18. output power at 1 db gain compression as a function of frequency fig 19. power gain as a function of frequency 001aam121 f (ghz) 2.11 2.17 2.15 2.13 26 28 24 30 32 p l(1db) (dbm) 22 (1) (2) (3) 001aam122 f (ghz) 2.11 2.17 2.15 2.13 12 14 10 16 18 g p (db) 8 (1) (2) (3) t case = 25 c. (1) rl in . (2) rl out . (3) isl. p l = 17 dbm; tone spacing = 1 mhz (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. fig 20. input return loss, output return loss and isolation as a function of frequency fig 21. output third-order in tercept point as a function of frequency f (ghz) 2.11 2.17 2.15 2.13 001aam123 ? 20 ? 10 0 ? 30 (1) (2) (3) rl in , rl out , isl (db) 001aam124 f (ghz) 2.11 2.17 2.15 2.13 40 42 38 44 46 ip3 o (dbm) 36 (1) (2) (3)
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 15 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier see table 14 for a list of components. fig 22. 5 v application reference board; 2110 mhz to 2170 mhz j3 gnd v cc gnd n.c. enable gnd c7 c6 c4 c3 c2 c1 r2 l1 c5 r1 msl5 msl4 msl1 msl2 msl3 j3 j1 rf in j2 rf out 001aam041 table 14. 5 v application list of components; 2110 mhz to 2170 mhz see figure 17 and figure 22 for component layout. printed-circuit board (pcb): rogers ro4003c st ack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks c1,c4 capacitor 15 pf dc blocking murata, grm1885c1h150ja01d c2 capacitor 2.4 pf input match murata, grm1885c1h2r4cz01d c3 capacitor 1.5 pf output match murata, grm1885c1h1r5cz01d c5 capacitor 15 pf rf decoupling murata, grm1885c1h150ja01d c6 capacitor 100 nf lf decoupling avx, 0603yc104kat2a c7 capacitor 10 f lf decoupling avx, 1206zg106zat2a j1,j2 rf connector sma emerson network power, 142-0701-841 j3 dc connector 6 pins molex l1 inductor 22 nh dc feed tyco electronics, 36501j022jtdg msl1 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match msl2 [1] micro stripline 1.14 mm 0.8 mm 11.2 mm input match msl3 [1] micro stripline 1.14 mm 0.8 mm 5.9 mm output match msl4 [1] micro stripline 1.14 mm 0.8 mm 6.0 mm output match msl5 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match r1 [1] resistor 1 yageo, rc0603fr-071rl
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 16 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier [1] msl1 to msl5 dimensions are specifi ed as width (w), spacing (s) and length (l). 12.1.4 2405 mhz to 2485 mhz at 5 v; 180 ma r2 [1] resistor 2 k trimmer bias adjustment bourns, 3214w-1-202e table 14. 5 v application list of components; 2110 mhz to 2170 mhz ?continued see figure 17 and figure 22 for component layout. printed-circuit board (pcb): rogers ro4003c st ack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks see table 15 for a list of components. pcb board specification: rogers ro4003c; height = 0.508 mm; r = 3.38; copper thickness = 35 m. fig 23. 5 v application schematic 2405 mhz to 2485 mhz c3 c4 c6 c7 c5 r1 r2 icq_adj shdn enable l2 l1 c2 c1 msl1 msl2 msl6 msl5 rf_in BGA7127 50 50 v cc 001aam04 2 msl4 v cc(bias) v cc(rf) msl3
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 17 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. fig 24. output power at 1 db gain compression as a function of frequency fig 25. power gain as a function of frequency f (ghz) 2.405 2.485 2.465 2.425 2.445 001aam125 26 28 24 30 32 p l(1db) (dbm) 22 (1) (2) (3) f (ghz) 2.405 2.485 2.465 2.425 2.445 001aam126 12 14 10 16 18 g p (db) 8 (1) (2) (3) t case = 25 c. (1) rl in . (2) rl out . (3) isl. p l = 17 dbm; tone spacing = 1 mhz (1) t case = 25 c. (2) t case = 85 c. (3) t case = ? 40 c. fig 26. input return loss, output return loss and isolation as a function of frequency fig 27. output third-order in tercept point as a function of frequency f (ghz) 2.405 2.485 2.465 2.425 2.445 001aam127 ? 20 ? 10 0 ? 30 (1) (2) (3) rl in , rl out , isl (db) f (ghz) 2.405 2.485 2.465 2.425 2.445 001aam128 40 42 38 44 46 ip3 o (dbm) 36 (1) (2) (3)
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 18 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier see table 15 for a list of components. fig 28. 5 v application reference board; 2405 mhz to 2485 mhz j3 gnd v cc gnd n.c. enable gnd c7 c6 c4 c3 c2 c1 r2 l2 c5 r1 msl6 msl5 msl1 msl2 msl3 msl4 j3 j1 rf in j2 rf out l1 001aam043 table 15. 5 v application list of components; 2405 mhz to 2485 mhz see figure 23 and figure 28 for component layout. printed-circuit board (pcb): rogers ro4003c st ack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks c1,c4 capacitor 15 pf dc blocking grm1885c1h150ja01d c2 capacitor 1.5 pf input match murata, grm1885c1h1r5cz01d c3 capacitor 1.5 pf output match murata, grm1885c1h1r5cz01d c5 capacitor 15 pf rf decoupling murata, grm1885c1h150ja01d c6 capacitor 100 nf lf decoupling avx, 0603yc104kat2a c7 capacitor 10 f lf decoupling avx, 1206zg106zat2a l1 inductor 3.3 nh input match tyco electronics, 36501j3n3jtdg l2 inductor 22 nh dc feed tyco electronics, 36501j022jtdg msl1 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match msl2 [1] micro stripline 1.14 mm 0.8 mm 8.6 mm input match msl3 [1] micro stripline 1.14 mm 0.8 mm 2.8 mm input match msl4 [1] micro stripline 1.14 mm 0.8 mm 6.0 mm output match msl5 [1] micro stripline 1.14 mm 0.8 mm 5.9 mm output match msl6 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match r1 resistor 1 yageo, rc0603fr-071rl
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 19 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier [1] msl1 to msl6 dimensions are specifi ed as width (w), spacing (s) and length (l). 12.2 pcb stack r2 resistor 2 k trimmer bias adjustment bourns, 3214w-1-202e table 15. 5 v application list of components; 2405 mhz to 2485 mhz ?continued see figure 23 and figure 28 for component layout. printed-circuit board (pcb): rogers ro4003c st ack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks dielectric constant for ro4003c; r = 3.38 fig 29. pcb stack through via rf and analog ground rf and analog routing analog routing rf and analog ground 35 m (1 oz.) copper + 0.3 m gold plating ro4003c, 0.51 mm (20 mil) 35 m (1 oz.) copper (1) 0.2 mm (8 mil) fr4, 0.15 mm (6 mil) 35 m (1 oz.) copper 35 m (1 oz.) copper 014aab08 7
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 20 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 13. package outline fig 30. package outline sot908-1 (hvson8) 0.5 0.2 1 0.05 0.00 a 1 e h b unit d (1) y e 1.5 e 1 references outline version european projection issue date iec jedec jeita mm 3.1 2.9 cd h 1.65 1.35 y 1 3.1 2.9 2.25 1.95 0.3 0.2 0.05 0.1 dimensions (mm are the original dimensions) sot908-1 mo-229 e (1) 0.5 0.3 l 0.1 v 0.05 w sot908-1 h vson8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm a (1) max. 05-09-26 05-10-05 note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. x terminal 1 index area b a d e detail x a a 1 c c y c y 1 exposed tie bar (4 ) exposed tie bar (4 ) b terminal 1 index area e 1 e a c b v m c w m e h d h l 14 5 8 0 1 2 mm scale
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 21 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 14. abbreviations 15. revision history table 16. abbreviations acronym description cpe customer-premises equipment dc direct current esd electrostatic discharge htol high temperature operating life ism industrial, scientific and medical mmic monolithic microwave integrated circuit moca multimedia over coax alliance rfid radio frequency identification sma subminiature version a tx transmit wlan wireless local area network table 17. revision history document id release date data sheet status change notice supersedes BGA7127 v.1 20100726 product data sheet - -
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 22 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
BGA7127 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 26 july 2010 23 of 24 nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors BGA7127 400 mhz to 2700 mhz 0.5 w high linearity silicon amplifier ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 26 july 2010 document identifier: BGA7127 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 shutdown control . . . . . . . . . . . . . . . . . . . . . . . 3 6 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 thermal characteristics . . . . . . . . . . . . . . . . . . 5 8 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 8.1 supply current adjustment . . . . . . . . . . . . . . . . 5 9 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 9.1 scattering parameters . . . . . . . . . . . . . . . . . . . 7 10 reliability information . . . . . . . . . . . . . . . . . . . . 7 11 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . 7 12 application information. . . . . . . . . . . . . . . . . . . 8 12.1 5 v application . . . . . . . . . . . . . . . . . . . . . . . . . 8 12.1.1 920 mhz to 960 mhz at 5 v; 180 ma . . . . . . . . 8 12.1.2 1930 mhz to 1990 mhz at 5 v; 180 ma . . . . . 11 12.1.3 2110 mhz to 2170 mhz at 5 v; 180 ma . . . . . 13 12.1.4 2405 mhz to 2485 mhz at 5 v; 180 ma . . . . . 16 12.2 pcb stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 22 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23 17 contact information. . . . . . . . . . . . . . . . . . . . . 23 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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